1 nic components corp. www.niccomp.com www.lowesr.com www.rfpassives.com www.smtmagnetics.com specifications are subject to change v-chip memory back-up capacitors nexc series nic p/n capacitance value (f) discharge working voltage (vdc) holding voltage (vdc min.) max. current @ 30 minutes (ma) max. esr @ 1khz ( ) nexc104z3.5v10.5x5.5trf 0.1 3.5 - 0.090 50 nexc224z3.5v10.5x5.5trf 0.22 3.5 - 0.200 25 nexc474z3.5v10.5x8.5trf 0.47 3.5 - 0.420 25 nexc473z5.5v10.5x5.5trf 0.047 5.5 4.2 0.071 50 nexc104z5.5v10.5x5.5trf 0.1 5.5 4.2 0.150 25 nexc224z5.5v10.5x8.5trf 0.22 5,5 4.2 0.330 25 nexc474z5.5v16x9.5trf 0.47 5.5 4.2 0.710 13 nexc105z5.5v21x10.5trf 1.0 5.5 4.2 1.500 7 rated voltage range 3.5 & 5.5vdc rated capacitance range 0.047f ~ 1.0f (47,000 f ~ 1,000,000 f) operating temp. range -25c ~ +70c capacitance tolerance +80%/-20% (z) load life test +70c 1,000 hours capacitance change less than 30% of initial measured value maximum esr less than 200% of the speci ed maximum value current at 30 minutes less than 200% of the speci ed maximum value temperature cycling (5 cycles, -25 ~ +70c capacitance change within +80%/-20% of speci ed value maximum esr less than speci ed maximum value current at 30 minutes less than speci ed maximum value humidity resistance (240 hours @ 40c/90% rh) capacitance change less than 20% of initial measured value maximum esr less than 120% of the speci ed maximum value current at 30 minutes less than 120% of the speci ed maximum value case size d 0.5 l max. a/b 0.2 i w p 10.5 x 5.5 10.5 5.5 10.8 3.6 0.5 1.2 5.0 10.5 x 8.5 10.5 8.5 10.8 3.6 0.5 1.2 5.0 16 x 9.5 16.0 9.5 16.3 6.8 1.0 1.2 5.0 21 x 10.5 21.0 10.5 21.6 7.0 1.0 1.4 10.0 features ? double layer construction ? power back-up for cmos devices ? surface mountable v-chip style ? lead-free finish case dimensions (mm) standard values and specifications characteristics + - 0.3mm max. d w p b a i l i i precautions washing is not recommended. additional precautions can be found at www.niccomp.com/precautions if in doubt or uncertainty, please review your speci c application - process details with nic?s technical support personnel: tpmg@niccomp.com *for high temperature +85c, high temperature re ow parts see the nexcw series
2 nic components corp. www.niccomp.com www.lowesr.com www.rfpassives.com www.smtmagnetics.com specifications are subject to change case diameter rst 10.5 5.0 4.6 2.5 16.0 5.0 10.0 2.5 21.0 10.0 10.5 3.5 land pattern dimensions (mm) t r s s component outline standard recommended reflow profile peak temperature (235c for 10 sec.) 50 100 150 200 250 time temperature - deg. c pre-heat 160c 120 sec. max. 25 0 cool down time above 200c 30 sec. max. v-chip memory back-up capacitors nexc series 1. the temperatures shown are the surface temperature values on the top of the can and on the capacitor terminals. 2. 2x re ow process maximum. capacitor should be allowed to return to room temperature before second re ow process.
3 nic components corp. www.niccomp.com www.lowesr.com www.rfpassives.com www.smtmagnetics.com specifications are subject to change v-chip memory back-up capacitors nexc series carrier tape dimensions (mm) case size a b d e f g p p 1 t 1 t 2 w quantity/reel 10.5 x 5.5 11.4 13.0 1.55 1.75 11.5 - 4.0 16.0 0.4 6.0 24.0 1,000 10.5 x 8.5 11.4 13.0 1.55 1.75 11.5 - 4.0 16.0 0.4 8.4 24.0 500 16 x 9.5 18.0 20.0 1.55 1.75 14.2 28.4 4.0 24.0 0.5 10.0 32.0 200 21 x 10.5 23.0 25.0 1.55 1.75 20.2 40.4 4.0 32.0 0.5 12.0 44.0 150 case size a 2.0 b 1.0 c 0.5 d 0.8 e 0.5 w t 10.5 x 5.5 380 80.0 13.0 21.0 2.0 25.5 3.0 10.5 x 8.5 380 100.0 13.0 21.0 2.0 25.5 2.8 16 x 9.5 330 100.0 13.0 21.0 2.0 33.5 2.8 21 x 10.5 370 100.0 13.0 21.0 2.0 45.5 2.8 a b c e w t w + 1.5 ? +0.1/- 1.75 a b e f d p 1 p t 1 t 2 - feeding reel dimensions (mm)
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